Until recently, dynamic graphics for realtime data display have been mostly restricted to high-end embedded applications. Hardware innovations, however, now make it possible for developers to create advanced multi-media displays for a broader range of devices, using layering techniques. Advances in hardware, combined with the increasing demand for graphical visual interfaces and the need to provide multi-media presentation with multiple displays showing different types of highly dynamic content, are driving the broader adoption of multi-layering in embedded systems.
But before multi-layering can be widely applied, developers need to be able to quickly and cost-effectively build multi-layered displays, deploy a mix of legacy and new applications, and port these between a range of hardware platforms.
Join QNX Software Systems and Fujitsu for a technical web seminar on multi-layering technology in embedded systems. Darrin Fry, software architect and GUI development manager, QNX Software Systems, will discuss market adoption factors and explore hardware composite innovations that have yielded lower cost, smaller footprint hardware support for multi-layering. He will present a new API that supports portability between hardware platforms and applications, and discuss the concepts of surfacing, event space mapping, and layer control, including panning, scaling and blending. Darrin will wrap up his presentation with a discussion on the future of advanced graphics technology, including 3D, OpenGL and their interaction with layering, panning and scaling.
Markus Mierse, Manager for Graphic Controller Products, Fujitsu, will conclude the session with a presentation on how Fujitsu supports multi-layering and advanced graphics capabilities for embedded applications.
This session will be of interest to development managers in automotive, medical, industrial automation, and interactive gaming who are developing embedded systems requiring a high degree of dynamic content to be displayed simultaneously on a single visual interface. Attend this technical seminar to: